Huawei is seeking a Senior MEMS Testing/Packaging Engineer to join our dynamic team.
In this role you will be responsible for providing the technical guidance and solutions for the development and characterization of optical MEMS switch systems for future optical networks. You must be expert in MEMS packaging, and electrical testing of MEMS devices such as optical MEMS mirror, accelerometer, pressure sensor, microphone or gyroscope. You will bring your strong engineering and product development experience in an R&D space to help guide our efforts in this competitive arena and you’ll add value to our team by contributing to the analysis, design, prototyping and testing of future optical communication systems. You’ll also help in prototype development in our lab and act as a technical lead in several high profile and mission critical projects the projects that support Huawei’s core business. You will have the opportunity to help plan and execute new lab research here at Huawei as well as to contribute to scientific literature and to represent us at industry conferences.
MS/PhD in Electrical Engineering, Mechanical Engineering, Physics, Optical Science or similar technical discipline
5-10 years of experience in packaging, and electrical testing of MEMS devices.
Strong knowledge of mechanical design and PCB layout software such as AutoCAD, SolidWorks and OrCAD.
Strong knowledge of electrical instrumentation such as capacitance meter, source meter, and LabVIEW.
Detailed oriented and strong problem solving skills.
Good interpersonal skills and team oriented.
Must be a self-starter with the ability to make critical decisions and follow projects through to completion.
Excellent written and verbal communication and organizational skills required.