As the Principal Engineer you will be a key team member on the chip engineering technology platform -Ready and Competitive Power (universal network, terminal). You will lead in research and development of advanced thermal materials characterization and integration and focus on hardware and manufacturing engineering to improve system thermal performance.
You will be supporting chip engineering technology platform in the successful application of products to solve key engineering problems and analyze the thermal limits in the chip/package/PCB in high performance systems and the impact to the system performance and reliability. The Principal Engineer will work with a team of architects and engineers to develop thermal management solutions (material, structures and design) to meet product performance target and track academics and industries progress on thermal. – Be the “Go to Expert” –
A Master’s Degree or above on material/mechanical/electrical engineering
Minimum 10 years’ experience on chip/package/PCB thermal analysis and solution on high power chip set system and proficient on thermal analysis tools
Knowledge on material properties and thermal structural solutions
Knowledge of network or wireless system is a plus
Experience and knowledge on mechanical is a plus
Knowledge of advanced semiconductor device structure and package process is a plus